1, ABS resin
Is Acrylonitrile-Butadine-Styrane (propylene-butadiene-styrene) composed of ternary mixed resin, butadiene rubber parts of which can be eroded by chromic acid and porosity, can be used as chemical copper or Nickel chemical landing point, so as to continue plating. Many assembled parts on the circuit board, using ABS plating.
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2, A-Stage A stage
Refers to the glass (Prepreg) manufacturing process, the reinforcement of glass fiber cloth or tissue paper, when impregnated through the glue tank engineering, the resin glue (Varnish, also translated into varnish water), is still in the monomer and is The state of solvent dilution, known as A-Stage. In contrast, when glass cloth or tissue is sucked into the glue and dried by hot air and infrared rays, the molecular weight of the tree fingers will be increased to Oligomer, and then attached to the reinforcing material to form a film. The resin state at this time is called B-Stage. When it continues heating to soften, and further polymerization to become the last polymer resin, then called C-Stage.
3, Bonding Sheet (layer) Bonding sheet, then layer
Refers to the "multilayer film" that is used to laminate and bond a rigid multilayer board, or the interface layer between a soft board "cover" and its board surface
4, B-Stage, B stage
Refers to the semi-cured thermosetting resin semi-hardened state, such as A-Stage epoxy impregnation project, the film attached to the glass fiber cloth on the resin, can be reheated and softened those who belong to this category.
5, Copolymer copolymer
CCL copper foil substrate is covered with the appearance of copper metal layer. The copper foil required for the PCB industry can be obtained by electrodeposition or by Rolled. The former can be used on general hardboards and the latter on flexible boards.
6, Coupling Agent coupling agent
Printed circuit board industry refers to the surface of the glass cloth coated with a layer of "silane compounds" category, so that in the epoxy resin and glass fiber between the combination of a "bridge hook" chemical bond between the two With more elastic elasticity and combination of firmness, the coupling agent will be able to avoid the separation of the two once the plates are subject to intense heat and produce very different expansion.
7, Crosslinking, Crosslinkage cross-linking, bridging
Thermosetting polymers are formed by bonding many monomers through their molecular bonds. The process of attachment is called "cross-linking."
8, C-Stage, C stage
The general substrate plate, the resin can be divided into A, B, C and other three kinds of hardening (also known as polymerization or curing) stage. For example, the most widely used epoxy resin is Varnish for impregnation, which is called A-Stage. Prepreq is impregnated with B-Stage. A plurality of semi-cured films Laminated with copper sheet into a book, and then in the high temperature pressure synthesis of the substrate. This kind of irreversible full-curing resin state is called C-Stage.
9, D-glass D glass
Refers to the use of high boron content of glass fiber, the substrate produced, so that the media can be controlled lower constant.
10, Dicyandiamide (Dicy) dicyandiamide
It is a bridging agent for epoxy curing because of its three strong activities such as primary amine (-NH2), secondary amine (= NH) and tertiary amine (≡NH) Reactive groups, is a rare excellent sclerosis agent, also known as Cyano-Guanidine cyanoguanidine. However, the water absorption of the material is very strong, and there is a trouble of re-aggregation "recrystallization" in the plate material. Therefore, it is necessary to grind the fine resin to impregnate the impregnated resin.
11, Differential Scanning Calorimetry (DSC) Differential scanning heat card analysis
Simply put, when a substance is heated, the rate at which "heat" flows into the substance at different temperatures (mcal / sec) will vary. DSC is to measure this "heat flow rate" (or rate of change of heat) at different temperatures, small changes. For example, when a commercial epoxy resin is heated, its "heat flow rate" at different temperatures is also different, but when it reaches the "glass transition temperature," its heat flow rate per ° C will vary greatly. Curve turning point at the intersection of the slope of the corresponding horizontal axis temperature, that is the Tg of the resin, it can be used to determine the Tg DSC. The DSC method is to heat the sample (S) and the reference (R) at the same time, because the "heat capacities" of the two are different, so the rising temperature is different, but the difference ΔT therebetween can be maintained. However, when it is about to reach the vicinity of the Tg, the ΔT between the two will greatly change, and the change of the temperature difference can be measured by the DSC. Is a modified "Thermal Analysis" (DTA). DSC can be used to measure the specific heat of plastic, crystallinity, curing degree of crosslinking, and purity, besides measuring the Tg of polymers. It is an important "thermal analysis" instrument.
12, Dip Coating dip coating method
Is a simple and cheap surface coating method. The thickness of the coating depends on the viscosity of the coating liquid and the speed of the coating. Prepreg used for circuit board substrate has been treated by this method, Painting, but also infiltrate the gap in the fiberglass cloth, it is also known as impregnated Impregnation.
13, E-glass electronic grade glass
E-glass was originally a trademark of the American Owens-Corning Fiberglass Co. and has become an academic term since it has been used in the circuit board industry for a long time. In addition to its basic composition of silicon and calcium, potassium content is very low, but it contains more boron and aluminum. Its resistance to electricity king of the insulation and processing are good, has been extensive use of circuit board substrate reinforcement purposes. Its composition is as follows: Boron oxide B2O3 5 to 10% Sodium oxide / potassium Na2O / K2O 0 to 2% Calcium oxide CaO 16 to 25% Titanium dioxide TiO2 0 to 0.8% Aluminum oxide A12O3 12 to 16% Iron oxide Fe2O3 0.05 to 0.4% Silica SiO2 52 to 56% Fluorine F2 0 to 1.0%
14, Entry Resin Epoxy resin
Is a very versatile thermosetting (Thermosetting) polymer, generally can be used as molding, packaging, painting, adhesive and other purposes. In the circuit board industry, but also the largest consumption of insulation and bonding resin, with glass fiber cloth, fiberglass seats, and white kraft paper and other composite into a plate, and can accommodate a variety of additives to achieve the difficult Burning and high-performance purposes, as all levels of circuit boards base material.
Exotherm Exothermic (curve)
A variety of resins in the process of polymerization and hardening, the term is carried out over time and heat dissipation curves in terms of. The maximum amount of heat released is the highest point of the temperature curve. And Exothermic Reaction-words are exothermic chemical reactions.
16, Filament fibril
Refers to the most basic unit of all kinds of fabric, which usually consists of a monofilament twisted together into a bundle of strands or multiple strands of yarn (Yarn), followed by "warp" and "weft" Weave the fabric needed. Usually Filament refers to the continuous filament, staple fibers are more Staple expression.
17, Fill zonal
Refers to the fiberglass cloth or printing mesh, the warp and weft in the weft direction, usually the unit length of wefts less than the number of warp yarn, so the intensity is less than adequate. This word has another synonym Weft.
Flame Resistant Flame retardant
Refers to the circuit board in its insulating sheet resin, in order to achieve a certain level of fire resistance (in UL94 is divided into HB, VO, V1 and V2 grade 4), must be deliberately added to the resin formulation of certain chemicals, such as Bromine, silicon, aluminum oxide (such as the FR-4 that is added more than 20% of bromine), so that the performance of the plate can reach a certain degree of flame resistance. The FR-4, which is generally flame resistant, imprinters the manufacturer's UL "red mark" watermark on the Warp side of its substrate (double panel) to indicate a flame resistant sheet. The non-flame retardant G-10, only in the warp printed "green" watermark mark. There is another synonym for this term, "Flame Retardent," but there is no such thing as a fire resist in the correct terminology of the circuit board, which is a layman's answer to the irresponsible word Erroneous assertion caused by the illegitimate authentic argument.
19, Gel Time Gelation time
Refers to the B-stage in the tree refers to the external heat, the solid into a fluid, and then slowly polymerization and then into a solid, during which to soften the "glue" by the total number of "seconds" Known as the "gelling time." That is, in the laminating process, allowing the flow of plastic out of the air, and fill up the inner level of ups and downs ups and downs, the number of seconds it can take advantage of the gelling time in practical sense. This is an important feature of prepreg prepreg.
20, Gelation Particle gel point
Refers to the B-stage film tree finger, the emergence of transparency has been the first polymerization of tree wax particles.
21, Glass Fiber glass fiber
Is the high-temperature molten glass paste squeeze out from the platinum mouth to obtain very fine filaments (Filament), known as the glass fiber. The glass can be collected 200 to 400 and twisted into glass yarn (Yarn), and then woven into glass fiberglass cloth, can be used as a film of reinforcing material. If a continuous staple fiber is cut into staple fibers of a fixed length, a plate material having a constant thickness by deposition is referred to as a Glass Mats.
22, Glass Transition Temperature, Tg glass transition temperature
Polymer due to the temperature rise and fall caused by changes in its physical properties. When it is at room temperature is a crystalline amorphous (amorphous) hard and brittle glassy material, will reach high temperatures will be transformed into a rubbery Elastomer (Elastomer), this from the "glassy state" significantly transformed into The narrow temperature range of "rubbery" is called the "glass transition temperature," abbreviated as Tg but should be read as "Ts of G" to indicate that the temperature of the transition is not at a certain temperature.
23, Heat Cleaning burn clean
Refers to the glass cloth that has been finished with the weaving operation, it is necessary to remove its sizing for the task of reducing friction in order to further "silane-bond" the glass cloth (Coupling Treatment) The binding force between the cloth and the resin), the method of removing the slurry is placed in a high-temperature furnace for "burning."
Refers to the reinforcement material (such as fiberglass cloth or insulating paper) of the substrate sheet, which is immersed in the liquid resin of the A-Stage and forced into the yarn bundle of the fiberglass cloth and forcibly expel the air, followed by Heat curing to dip the film, or "impregnated."
25, Novolac ester resin
One of the most common single-sided panels is Phenolic Resin, a resin that is gradually sterically bridged by dehydration-condensation of both phenols (C6H5OH) and aldehydes (Formaldehyde). Novolac (an early trade name, now commonly used as a scientific name) is said to be a product if its finished product has less phenolic and is catalyzed by an acidic environment. Conversely, if the reaction in an alkaline environment, the product appears more phenol less aldehyde, then called Resole. The latter is mostly used in single-sided substrates. Novolac can be further reacted with Epoxy to become a copolymer, which increases the mechanical strength and dimensional stability of Epoxy. As a result, the performance of FR-4 can be improved to some extent, which is called high functional resin. Usually, The amount of epoxy resin in about 5 to 9% by weight. The epoxy structure of Bisphenol-A in the Novolac after the formation of more cross-linking (Crosslinking), and to make Tg increased, in the solvent resistance, water resistance are also better. But it is also a cause of bit damage and the difficulty of removing Smear Removal. The following four formula is generally Resole reaction catalyzed by strong base, the aldehyde part of the product far more than phenol, is the main component of the resin substrate of single-sided paper: phenolic resin as early as 1910 by a company called Bakelite , Joined the canvas fiber and made a hard and strong insulation and good material, called Bakelite, Chinese translated as "Bakelite", in the industry has been used for a long time, even the dictionary has been included as an official word.
26, Opaquer opacity, sunscreens
Refers to the special resin added to the plate resin, so that the glass fiber cloth and translucent resin composition of the substrate, with an opaque effect. When the circuit board in the use of photosensitive green imaging paint, the exposure process will be due to the role of sheet opacity, and prevent ultraviolet light through the plate to reach the other side to cause unexpected exposure. This Opaquer is especially important for the growing number of sheets. Opacity refers to the "shade" of a board as the inverse of "Transmittance".
27, Plasticizers plasticizers, plasticizers
Is a series of chemicals that can be added to various types of plastics to provide good workability, flame resistance and insulation of the product. These plasticizers are divided into the original and secondary two categories, the original grade can be dissolved with the original resin and as a promoter, to improve its properties and to achieve a certain standard; secondary plasticizer is mainly used to assist The original level and can achieve the purpose of reducing costs.
28, Ply layer, shares
Refers to the sheet of glass cloth or kraft paper, "layers", also refers to the time ropes, wires, fibers, etc., by the two or several shares of the "wire" (Filament) and twisted from each of its "branch" Wire is also known as one.
29, Polymerization polymerization
Refers to the polymerization of smaller molecules of monomers or groups, under controlled conditions, the head and tail phase structure in a linear manner