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PCBA Technology
The Company Offers
Our State-of-the-art Capabilities
With 15 years of expertise in the PCBA industry, we combine cutting-edge technology with proven experience to deliver tailored solutions for your most unique challenges.
- SMT
- THT
- BGA
Placement Accuracy:
- Repeatability: ±25μm (Cpk ≥ 1.0).
- Component Range: 01005 (0.4×0.2mm) to 55mm² (max. height: 15mm).
- Laser + vision hybrid alignment, auto-compensation for PCB warpage and component misalignment.
Automated THT Insertion:
- Consistency: Defect rate <0.05%.
- Component Size Range: Lead Diameter: 0.3–2.0 mm, Component Height: 1–25 mm.
Manual THT: Adaptation to non-standard components, large (transformers) or fragile components
Learn More >>>BGA Technical Parameters:
- Ball Pitch: Typical: 0.3mm–1.27mm, Ultra-Fine Pitch (UFBGA) down to 0.2mm.
- Ball Diameter Standard: 0.15mm–0.76mm, Matched to pitch for reliability.
- Package Size: Range: 5mm×5mm–50mm×50mm.
Productive Capacity
| Item | Capability Content | Item | Capability Content |
|---|---|---|---|
| Solder Paste Printing | Accuracy:±0.025mm | Wave Soldering | Nitrogen source: external |
| Max. speed: 150mm/sec | Speed: 5in² /sec (60FOV/sec) | ||
| PCB max. area: 400*310mm | Temperature accuracy: ±1°C | ||
| PCB thickness: 0.2-6mm | Lead free compatible | ||
| SMT | Accuracy: ±0.03mm | AOI | Accuracy: ±0.0024mm |
| Speed: 0.17sec/pc | Speed: 5in² /sec (60FOV/sec) | ||
| PCB max. area: 350*350mm | PCB max. area:300*300mm | ||
| Available part: 0201 chip to 35*35mm | Available component: 0201 chip and fine pitch | ||
| Accuracy: ±0.05mm | X-ray Inspection | BGA void(0.5mm distance between Ball) | |
| Available part: 0402 chips to 14mm (H 12mm) | Solderability inner shielding | ||
| Minimum SMD resistor and capacitor: 0201 |
Equipment Specification
| Machine | Solder Paste Printer | SPI | SMT | SMT | SMT |
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| Model | DSP-1008 | I350a | YS24 | YG12F | YG12 |
| Brand | DESEN | Sinic-Tek | YAMAHA | YAMAHA | YAMAHA |
| Board size | 50*50-400*340mm | 50*50-400*350mm | 0402~32*32mm L50*W50~L700*W 460mm | 0402~-45*100mm L50*W50mm-L510*W460mm | L50*W50mm~L510*W 460mm |
| Electrical source | 220V AC | 220V AC/15A | 220V AC | 220V AC | 220V AC |
| Power consumption(kw) | 3 | 1.6 | 4.7 | 4.7 | 4.7 |
| Air(kg/cm2) | 4.5~6kg/cm2 | 0.5Mpa | 0.45Mpa | 0.55Mpa | 0.55Mpa |
| Characteristics | Printing precision ±0.025mm Repeat accuracy ±0.01mm | Minimum pad spacing | SMT precision ±0.05mm( μ+3σ)、±0.03mm(3σ)Types of components120/8mm | Types of components 48/8mm | Types of components 60/8mm |
| Machine | Reflow | Reflow | Reflow | AOI | X-Ray |
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| Model | Heller 1809 | Heller 1826 | FLEX XPM-2 | MT-2000 | ZM-X7800 |
| Brand | Heller | Heller | Vitronics | MVTE | SEAMARK |
| Board size | 50-508mm | 50-560mm | 50-565mm | 25*25~368*488mm | 500mm*500mm |
| Electrical source | 380V100 Amp/12KVA | 380V 3Phase | 380V | 220V | AC110-220V VAC50/60Hz |
| Power consumption(kw) | 43 | 43 | 12 | 4 | 1.7 |
| Air(kg/cm2) | 3 | 3 | 3 | 3 | 1.8 |
| Characteristics | Resolution:12μm FOV:20*20mmm |