Rigid-Flex Printed Circuit Boards utilize a combination of rigid and flexible circuit board technologies to create applications. As we know, multilayer flexible circuit substrates are typically attached to a rigid board, either externally and/or internally, depending on the design of the application. During the manufacturing or installation process, the flexible substrates are often shaped into curved bends, maintaining a constant bend state. Designing Rigid-Flex boards is more complex than typical rigid board environments because the boards are created in three-dimensional space. This also provides greater efficiency in spatial utilization. When designing in three-dimensional space, the flexible board substrates can be twisted, folded, and rolled as required to achieve the desired shape for the application packaging.

Its advantages include:

● These boards are highly resistant to impact. They can also prevent high vibrations. Therefore, the circuit boards will be able to withstand extreme conditions, featuring significant resistance to vibration and shock, ensuring greater durability. High-precision manufacturing guarantees enhanced safety. These printed circuit boards are very space-saving due to their highly dense design. Thus, they can be used within minimal areas. Moreover, assembling other components into the device will be less costly, allowing for greater profit margins.

● Due to their rigidity, these boards make assembly safer and easier compared to ordinary flexible boards. Assembly of these printed circuit boards is straightforward because their rigidity and flexibility combine to facilitate simple assembly applications. Rigid-Flex circuit boards will reduce overall costs for different equipment assembly applications.

● You can leverage the development of mechanical complexity to enhance the optimization and customization of these boards. Because it is a custom application, it can be used in sensitive industries.